Glossary & Terminology PCB Manufacturing QualiEco Canada

Glossary and Abbreviations - PCB Glossary

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Alphabet L

LaminateA composite material made by bonding together several layers of same or different materials.
LaminationThe process of manufacturing a laminate using pressure and heat.
Laminate ThicknessThickness of the metal-clad base material, single or double-sided, prior to any subsequent processing.
Laminate VoidAn absence of epoxy resin in any cross-sectional area that should normally contain epoxy resin.
LandThe portion of the conductive pattern on printed circuits designated for the mounting or attachment of components. Also called a pad.
Laser Photo-PlotterA plotter that uses a laser, which simulates a vector photo-plotter by using software to create a raster image of the individual objects in a CAD database, then plots the image as a series of lines of dots at a very fine resolution. A laser photo-plotter is capable of more accurate and consistent plots than a vector plotter.
Layer SequenceLayer sequence helps to build the layer stack up from top to bottom and one can and its very help to CAD to identify the type of layer.
LayersThe layers give indication of different sides of PCB. On-board text such as company name, logo, or part number that is oriented right-reading on the top layer will quickly allow us to determine that files have been imported correctly. This simple step can save a time-consuming hold notice and potential hold up. Please note: any traces on outer layer that are 0.010" wide or less will require ½ ounce copper starting weight to prevent excessive trace width reduction.
Lay upThe process in which treated prepegs and copper foils are assembled for pressing.
Leakage CurrentA small amount of current that flows across a dielectric area between two adjacent conductors.
LegendA format of printed letters or symbols on the PCB, such as part numbers and product number or logos.
LotA quantity of circuit board that share a common design.
Lot CodeSome Customers require a manufacturer's lot code to be placed on the board for future tracking purposes. A drawing can specify the location, what layer and if it is to be in copper, mask opening, or silkscreen. This option is available on the Full-Featured instant quote.
LPI – (Liquid Photo-Imageable Solder Mask)An ink that is developed off using photographic imaging techniques to control deposition. It is the most accurate method of mask application and results in a thinner mask than dry film solder mask. It is often preferred for dense SMT. Application can be spray or curtain coat.

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